Method for the transfer of flux coated particles to a substrate

A method for loading solder particles (14) onto an substrate comprising applying a flux (18) directly onto solder particles (14) either prior to or following adhering the solder particles (14) onto adhesive areas (30) of an adhesive coated film (20). The adhesive areas (30) of the adhesive coated fi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HOTCHKISS GREGORY B, AMADOR GONZALO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for loading solder particles (14) onto an substrate comprising applying a flux (18) directly onto solder particles (14) either prior to or following adhering the solder particles (14) onto adhesive areas (30) of an adhesive coated film (20). The adhesive areas (30) of the adhesive coated film (20) are oriented to correspond with contact pads (42) of a substrate (16). The adhesive coated film (20) is aligned with the substrate (16) to transfer the solder particles (14) to the contact pads (42). The solder particles (14) may then be reflowed to securely attach the solder particles (14) to the contact pads(42).