Method for improving the adhesion of a photopolymerizable composition to copper
A method of increasing the adhesion of a photopolymerizable composition and the photopolymerized composition formed therefrom, which method comprises the step of adding an adhesion promoter, which consists essentially of a polycarboxylic acid having three to six carbon atoms, to the photopolymerizab...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A method of increasing the adhesion of a photopolymerizable composition and the photopolymerized composition formed therefrom, which method comprises the step of adding an adhesion promoter, which consists essentially of a polycarboxylic acid having three to six carbon atoms, to the photopolymerizable composition. |
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