Apparatus for mapping scratches in an oxide film

A method and apparatus for detecting scratches on a wafer surface. The method comprises the use of a monitor wafer which has a substrate, a first layer deposited on the substrate, and a second layer deposited on the first layer. The first and second layers have contrasting work functions such that w...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LANDERS WILLIAM FRANCIS, SINGH JYOTHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method and apparatus for detecting scratches on a wafer surface. The method comprises the use of a monitor wafer which has a substrate, a first layer deposited on the substrate, and a second layer deposited on the first layer. The first and second layers have contrasting work functions such that when short wavelength light is directed on the monitor wafer, scratches through the second layer can be detected.