Radiation-sensitive resin composition

A radiation-sensitive resin composition comprising (a) a resin represented by a copolymer of p-hydroxystyrene and t-butyl (meth)acrylate and a copolymer of p-hydroxystyrene and p-t-butoxystyrene, (b) a photoacid generator, and (c) a quaternary ammonium salt compound represented by tetramethylammoniu...

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Bibliographische Detailangaben
Hauptverfasser:	NUMATA JUN, CHIBA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	A radiation-sensitive resin composition comprising (a) a resin represented by a copolymer of p-hydroxystyrene and t-butyl (meth)acrylate and a copolymer of p-hydroxystyrene and p-t-butoxystyrene, (b) a photoacid generator, and (c) a quaternary ammonium salt compound represented by tetramethylammonium adamantanecarboxylate, tetramethylammonium oxalate, tetraethylammonium pyruvate. The radiation-sensitive resin composition is capable of producing a rectangular resist pattern while preventing the top edge of the pattern from rounding, which is a big problem in microprocessing of design dimensions of about 0.20 mum with a thin film. The radiation-sensitive resin composition is highly sensitive to deep ultraviolet radiation, X-rays, and charged particle rays and exhibits excellent sensitivity, resolution, and the like.