Transient cooling augmentation for electronic components

An electronic assembly that may include a two-phase material that absorbs heat generated by an integrated circuit. The heat may be transferred from the integrated circuit to the two-phase material by a heat pipe. The two-phase material can absorb heat in an isothermal process utilizing the latent he...

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Bibliographische Detailangaben
1. Verfasser:	POLLARD, II LLOYD
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE WEAPONS
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Beschreibung
Zusammenfassung:	An electronic assembly that may include a two-phase material that absorbs heat generated by an integrated circuit. The heat may be transferred from the integrated circuit to the two-phase material by a heat pipe. The two-phase material can absorb heat in an isothermal process utilizing the latent heat of the material. The isothermal process allows the two-phase material to absorb heat generated by the integrated circuit without raising the temperature of the assembly.