Printed-circuit board

A printed-circuit board according to the present invention includes: a plurality of insulating layers; a plurality of conductive patterns formed in each insulating layer; and a plurality of closed and curved patterns each formed around the conductive patterns in each insulating layer, and each forme...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KONDO KOJI, ODA RYUJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A printed-circuit board according to the present invention includes: a plurality of insulating layers; a plurality of conductive patterns formed in each insulating layer; and a plurality of closed and curved patterns each formed around the conductive patterns in each insulating layer, and each formed by a material having a coefficient of linear thermal expansion smaller than that of the insulating layer. In this case, each closed and curved pattern is made of copper and formed of same material as that of each conductive pattern. Further, when the coefficient of linear thermal expansion of each insulating layer is alpha1, when the coefficient of linear thermal expansion of each conductive layer is alpha2, and when the coefficient of linear thermal expansion of each closed and curved pattern is alpha3, the following condition, i.e., alpha1>alpha2>=alpha3, is satisfied.