Method for achieving substantially uniform expansion of dielectric plate and electrical connector made in accordance therewith

An electrical connector includes a dielectric base plate in which steel and copper strips are embedded. The steel and copper strips are respectively arranged in opposite sides of the base plate substantially perpendicular to and interconnected to each other whereby when the base is subject to a heating process, the steel and copper strips limit and control thermal expansion in different directions of the base plate and reduce differences in thermal expansion between the base plate and a circuit board to which the connector is mounted. Furthermore, a method for achieving substantially uniform thermal expansion of a dielectric plate is also provided and comprises the steps of (1) providing a dielectric plate made by injection molding and (2) fixing steel and copper strips thereto for limiting and controlling the expansion of the plate in different directions to achieve substantially uniform thermal expansion of the plate.