Enclosure mounted heat sink

A heat sink for a heat generating component of a computer system, such as a central processing unit (CPU), attaches to the computer system enclosure. The heat sink may be pressed against the component to establish thermal contact with the component. Because the heat sink attaches to the computer sys...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OSBORN JAY K, STOLZ HOWARD W, HRUSKA DANIEL B
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A heat sink for a heat generating component of a computer system, such as a central processing unit (CPU), attaches to the computer system enclosure. The heat sink may be pressed against the component to establish thermal contact with the component. Because the heat sink attaches to the computer system enclosure and not the component, the component socket, or a circuit board; the heat sink may be unusually shaped and large, while still allowing easy access to the components mounted within the computer system enclosure. Removing the enclosure panel on which the sink is attached may allow easy access to the components within the computer enclosure. The heat sink may be particularly useful in computer systems that use only natural convection cooling.