Flip chip C4 extension structure and process

An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a conductive structure that couples a first substrate to a second substrate. The first substrate may include a chip or a module. The second substrate may include a chip carrier or a circuit card....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MILKOVICH CYNTHIA SUSAN, JIMAREZ MIGUEL ANGEL, PIERSON MARK VINCENT
Format: Patent
Sprache:eng
Schlagworte:
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