Bus bar heat sink

A multiple current path device, for carrying electric current to and conducting heat from an electronic circuit, comprising an optional heat sink, a plurality of conducting substrates forming several electrically insulated current conductors, a thermally conductive, electrically insulating first lay...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LANKIN ROBERT G, SCHUURMAN DEREK C, HELLINGA RICHARD J
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A multiple current path device, for carrying electric current to and conducting heat from an electronic circuit, comprising an optional heat sink, a plurality of conducting substrates forming several electrically insulated current conductors, a thermally conductive, electrically insulating first layer, bonding each conducting substrate and the heat sink, and a plurality of electronic or electric components bonded to the substrates.