Electrostatic device for supporting wafers and other components for use at temperatures of up to 230° C

Electrostatic device for supporting wafers and other components for use at temperatures of up to 230° C

An electrostatic chuck for clamping an electrically conducting workpiece includes an electrode that is incorporated between two insulating layers of an organic material, preferably polyimide, and that is mounted, with or without a coating, on a metallic pedestal. An insulating intermediate layer, fo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BUSSE KARL-HERMANN, ARIT JOACHIM
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An electrostatic chuck for clamping an electrically conducting workpiece includes an electrode that is incorporated between two insulating layers of an organic material, preferably polyimide, and that is mounted, with or without a coating, on a metallic pedestal. An insulating intermediate layer, for example, in the form of an intermediate ring having a thickness equal to or up to 10% greater than the thickness of the electrode, provided for eliminating a gap at the edge of the electrostatic chuck.