Micromachined variable capacitor

First and second wafers are micromachined by standard integrated-circuit fabrication techniques to respectively make first and second component parts of a variable capacitor. A thin flexible membrane in the first wafer is integral with and mechanically supported by the first wafer. A metal pattern o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WALKER JAMES ALBERT, GAMMEL PETER LEDEL
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:First and second wafers are micromachined by standard integrated-circuit fabrication techniques to respectively make first and second component parts of a variable capacitor. A thin flexible membrane in the first wafer is integral with and mechanically supported by the first wafer. A metal pattern on the first wafer includes a first capacitor plate on the membrane. In the second wafer, a well is formed. A metal pattern on the second wafer includes a second capacitor plate in the well. By bonding the two parts together face-to-face, the capacitor plates are positioned in spaced-apart alignment with each other. External electrical connections to the plates are made via bonding-pad portions of the metal patterns on the wafers. In response to electrical control signals, the metal plate on the membrane can be moved toward the other plate, thereby selectively changing the capacitance of the assembly.