Method and apparatus for identifying customized integrated circuits

Method and apparatus for identifying customized integrated circuits

An integrated circuit having a unique identifying module includes a first and second bonding pads that are deposited on a die. The identifying module further includes a bond determining module that is operably coupled to the first and second bonding pads. As coupled, the bond determining module dete...

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1. Verfasser: HANSFORD ALAN W
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HANSFORD ALAN W
description An integrated circuit having a unique identifying module includes a first and second bonding pads that are deposited on a die. The identifying module further includes a bond determining module that is operably coupled to the first and second bonding pads. As coupled, the bond determining module determines the bonding status of the first and second bonding pads. For example, the bonding status indicates whether a packaged pin is bonded to the first bonding pad, the second bonding pad, both bonding pads or neither bonding pad. Based on the bonding status, the bond determining module produces a die identifier which uniquely identifies the integrated circuit.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method and apparatus for identifying customized integrated circuits
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