Method and apparatus for identifying customized integrated circuits
An integrated circuit having a unique identifying module includes a first and second bonding pads that are deposited on a die. The identifying module further includes a bond determining module that is operably coupled to the first and second bonding pads. As coupled, the bond determining module dete...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An integrated circuit having a unique identifying module includes a first and second bonding pads that are deposited on a die. The identifying module further includes a bond determining module that is operably coupled to the first and second bonding pads. As coupled, the bond determining module determines the bonding status of the first and second bonding pads. For example, the bonding status indicates whether a packaged pin is bonded to the first bonding pad, the second bonding pad, both bonding pads or neither bonding pad. Based on the bonding status, the bond determining module produces a die identifier which uniquely identifies the integrated circuit. |
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