Removable electronic subassembly with a compressible shock absorbing device

A removable electronic subassembly is designed for placement into a data processing system which requires said removable electronic subassembly to fit into an aperture defining a selected form factor. The removable electronic subassembly comprises a rigid enclosure which encloses interior components...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	NAGARAJAN SUBRAHMANYAN
Format:	Patent
Sprache:	eng
Schlagworte:	BOOK COVERS BOOKBINDING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER LOOSE LEAVES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR SPECIAL PRINTED MATTER TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A removable electronic subassembly is designed for placement into a data processing system which requires said removable electronic subassembly to fit into an aperture defining a selected form factor. The removable electronic subassembly comprises a rigid enclosure which encloses interior components of the removable electronic subassembly. The rigid enclosure has exterior dimensions which are smaller than the selected form factor. A layer of resilient material is mounted to an exterior of the rigid enclosure. The layer of resilient material and the rigid enclosure have at least one exterior dimension which exceeds the selected form factor in an uncompressed state wherein the resilient material may be compressed such that the at least one exterior dimension conforms to the selected form factor.