Method of forming node contact opening

A method of fabricating a node contact opening includes formation of a dielectric layer on a substrate. An opening is formed with C4F8/Ar/CH2F2 as an etchant. A portion of the dielectric layer under the opening is etched with CHF3/CO as an etchant until the substrate is exposed. A node contact openi...

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Bibliographische Detailangaben
Hauptverfasser:	LIN KUOI, TSAI CHIEN-HUA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A method of fabricating a node contact opening includes formation of a dielectric layer on a substrate. An opening is formed with C4F8/Ar/CH2F2 as an etchant. A portion of the dielectric layer under the opening is etched with CHF3/CO as an etchant until the substrate is exposed. A node contact opening is formed.