Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage

A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the pallet and a second portion that is bonded to the bottom surface of the printed wiring board so that the ins...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BUONDELMONTE CHARLES JOSEPH, PICOT WALTER J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the pallet and a second portion that is bonded to the bottom surface of the printed wiring board so that the insert is movable, relative to the pallet, in a plane parallel to the PWB. In one embodiment, the pallet includes an opening having a first portion and a second portion that is larger than the first portion, and the first and second portions of the insert fit at least partially in the respective first and second portions of the pallet opening. In another embodiment, the insert has a thickness that is equal to or greater than the thickness of the pallet.