Base for wire bond checking

A base mainly includes a heating plate and a probe. The probe is attached to the surface of a heating plate which serves to place a substrate having an ball pad on a lower surface facing the probe of the heating plate. The probe contacts the ball pad of the lower surface of the substrate to form a closed loop for wire bond checking while the substrate is placed on the heating plate. When processing the wire bond, the wire connecting the chip and the ball pad of the substrate and the probe connecting to the wire bond checking system form a loop. Then a current is sent to the substrate from the wire bond checking system to check for wire lift bond or missed wire. When the wire bond checking system finds an occurrence of lift bond or missing wire, the wire bonding process stops immediately to avoid unnecessary wire bonding.