Solder resist window configurations for solder paste overprinting

There is disclosed herein an electronic circuit assembly, such as a printed circuit board, having solder resist windows with one or more enlarged solder resist pullback zones, thereby facilitating solder paste overprinting.

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Bibliographische Detailangaben
Hauptverfasser:	JAIRAZBHOY VIVEK AMIR, MCMILLAN RICHARD KEITH
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	There is disclosed herein an electronic circuit assembly, such as a printed circuit board, having solder resist windows with one or more enlarged solder resist pullback zones, thereby facilitating solder paste overprinting.