Polishing pad, polishing apparatus and polishing method

A polishing pad for chemical mechanical polishing capable of simultaneously realizing a reduction of process costs by the reduction of the amount of usage of a polishing slurry and an improvement of a polishing quality of a wafer surface, and a polishing apparatus and a polishing method using the sa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAKAJIMA, HIDEHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	A polishing pad for chemical mechanical polishing capable of simultaneously realizing a reduction of process costs by the reduction of the amount of usage of a polishing slurry and an improvement of a polishing quality of a wafer surface, and a polishing apparatus and a polishing method using the same, provided with a first area A at a side of a predetermined radial line R of the polishing pad in the direction of rotation or advance 30 of the polishing pad, a second area B at an opposite side thereof, and grooves having projecting portions 203 in a direction opposite to the direction of rotation or advance 30 of the polishing pad formed only in the second area B.