Semiconductor wafer analysis system and method

A semiconductor wafer analysis system and method. In various embodiments, methods and systems are described for inspection and review of semiconductor wafers. Wafer inverters are provided, and inspection data is gathered for both the front and back sides of the wafers. The wafer inverters are also a...

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Bibliographische Detailangaben
Hauptverfasser:	WOOTEN, CHRIS, EHRICHS, EDWARD E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A semiconductor wafer analysis system and method. In various embodiments, methods and systems are described for inspection and review of semiconductor wafers. Wafer inverters are provided, and inspection data is gathered for both the front and back sides of the wafers. The wafer inverters are also available at wafer review stations so that both the front and back sides of the wafers can be reviewed with a microscope.