Process for manufacturing a circuit board with filled holes

A process for manufacturing circuit boards comprising providing a circuitized substrate having a dielectric surface, providing a peel apart structure including a metal layer and a peelable film, laminating the peel apart structure to the circuitized substrate with the metal layer positioned adjacent...

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Bibliographische Detailangaben
Hauptverfasser: MORING, ALLEN F, BHATT, ANILKUMAR CHINUPRASAD, GLATZEL, DONALD HERMAN, RUSSELL, DAVID JOHN, MARKOVICH, VOYA RISTA, PAPATHOMAS, KOSTAS
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A process for manufacturing circuit boards comprising providing a circuitized substrate having a dielectric surface, providing a peel apart structure including a metal layer and a peelable film, laminating the peel apart structure to the circuitized substrate with the metal layer positioned adjacent said dielectric surface, forming holes in the circuitized substrate through the peel apart structure, applying a filler material including an organic base to the peel apart structure, applying a sacrificial film onto the filler material, and applying sufficient heat and pressure to the sacrificial film to force the filler material into the holes to substantially fill the holes is provided.