Lightweight miniaturized integrated microsatellite employing advanced semiconductor processing and packaging technology

Lightweight miniaturized integrated microsatellite employing advanced semiconductor processing and packaging technology

A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafer...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JOSHI, ABHAY M
Format: Patent
Sprache:eng
Schlagworte:
AIRCRAFT
ANTENNAS, i.e. RADIO AERIALS
AVIATION
BASIC ELECTRIC ELEMENTS
COSMONAUTICS
ELECTRICITY
PERFORMING OPERATIONS
TRANSPORTING
VEHICLES OR EQUIPMENT THEREFOR
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafers. In this manner a micro-packaged device or system is obtained for use amongst other things in lightweight miniaturized microsatellites.