Metal substrate having an IC chip and carrier mounting

A package for mounting an integrated circuit chip to a circuit board or the like is provided. The package includes a chip carrier which has a metal substrate including first and second opposed faces. A dielectric coating is provided on at least one of the faces, which preferably is less than about 20 microns in thickness, and preferably has a dielectric constant from about 3.5 to about 4.0. Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads. An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon. In any case, the IC chip is electrically connected to the chip mounting pads either by the solder ball or wire bond connections. Electrical leads extend from the connection pads on the chip carrier and are connected to corresponding pads on a circuit board or the like to provide I/O signals for the IC chip. In certain embodiments, additional heat sinks can be attached to the chip carrier and, also in certain embodiments, chips can be mounted on both sides of the chip carrier to increase the capacity of the chip carrier.