Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the vi...

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Bibliographische Detailangaben
Hauptverfasser:	SURA, VIVEK MADAN, AOUDE, FARID YOUSSIF, FAROOQ, SHAJI, LASKY, HAL MITCHELL, NATARAJAN, GOVINDARAJAN, DIVAKARUNI, RENUKA SHASTRI, MASTREANI, ANTHONY, VALLABHANENI, RAO VENKATESWARA, WALL, DONALD RENE, HERRON, LESTER WYNN, DAVID, LAWRENCE DANIEL, REDDY, SRINIVASA S. N
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.