Servo driven watercutter

An apparatus for cutting a moving substrate includes a cutter nozzle connected to a movable support. A supplying mechanism provides a cutting fluid to the cutter nozzle at a pressure which provides for a fluid flow rate from the cutter nozzle which is sufficient to cut the substrate in a selected cut pattern. A designating mechanism identifies a plurality of selected article lengths along the substrate, and a transporting mechanism moves the substrate at a predetermined speed along the machine direction during the cutting of the substrate. An actuating servo moves the cutter nozzle along a selected cutting path, and a regulating mechanism controls the actuating servo by employing a selected, electronically stored data set. The data set is configured to move the actuating servo in a selected sequence, and the sequence has a predetermined correspondence with the movement of the substrate to thereby direct the cutter nozzle along the selected cutting path and provide the selected cut pattern on the substrate.