Cathodic sputtering device

PCT No. PCT/EP97/01871 Sec. 371 Date May 26, 1999 Sec. 102(e) Date May 26, 1999 PCT Filed Apr. 14, 1997 PCT Pub. No. WO97/39161 PCT Pub. Date Oct. 23, 1997A target for a cathode sputtering device for producing coatings on a substrate (27) by a sputtering cathode (2), which can be introduced into a vacuum chamber, the target having a center axis (44) and being dynamically balanced with respect to the center axis (44) and having a back surface (40) and a target surface (41), the target surface (41) being spaced from the back surface and being concave as a new target surface. The target surface (41) is formed by at least two concentric target surface portions which are inclined with respect to each other, the target surface portions including an outer, radially inwardly extending target surface portion (49, 76) enlarging conically away from the center axis in a direction away from the back surface, and an inner, radially outwardly extending target surface portion (78') narrowing conically toward the center axis in the direction away from the back surface. The target surface (41) has a radially outer edge delimited by an axially projecting edge (72) being inclined with respect to the center axis (44). A concentric target surface intermediate portion (50) extending in a plane perpendicular to the center axis (44) is provided between the outer target surface portion (49) and the axially projecting edge (72).