Electronic device having self-aligning solder pad design

A substrate (200) to which a component (210) is mounted includes at least two mounting pads (215, 220) formed thereon for electrically coupling to a single terminal of the component (210) and for aligning the component (210) on the substrate (200) during a reflow operation.

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Bibliographische Detailangaben
Hauptverfasser:	BEESCH, DIANN J, HUYNH, DUE, SMITH, TODD L
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A substrate (200) to which a component (210) is mounted includes at least two mounting pads (215, 220) formed thereon for electrically coupling to a single terminal of the component (210) and for aligning the component (210) on the substrate (200) during a reflow operation.