Process for producing corrosion-resistant terminal metal pads for thin film packages

A process for producing a terminal metal pad structure electrically interconnecting a package and other components. More particularly, the invention encompasses a process for producing a plurality of corrosion-resistant terminal metal pads. Each pad includes a base pad containing copper which is enc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PERFECTO, ERIC D, CHENG, TIEN-JEN, PENNACCHIA, JOHN R, GIRI, AJAY P, MALHOTRA, ASHWANI K, YU, ROY
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A process for producing a terminal metal pad structure electrically interconnecting a package and other components. More particularly, the invention encompasses a process for producing a plurality of corrosion-resistant terminal metal pads. Each pad includes a base pad containing copper which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad.