Method for establishing electrical communication between a first object having a solder ball and a second object
A method for establishing electrical communication between a first and second object, comprising the steps of 1) obtaining a first object in electrical communication with at least one BLM, each at least one BLM in contact with a high melting point solder ball coated with a low melting point solder,...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A method for establishing electrical communication between a first and second object, comprising the steps of 1) obtaining a first object in electrical communication with at least one BLM, each at least one BLM in contact with a high melting point solder ball coated with a low melting point solder, the low melting point solder contacting each solder ball over at least the portion of the solder ball not in contact with the BLM; 2) interacting a second object having at least one attachment point, each at least one attachment point corresponding to at least one solder ball on the first object where electrical communication is desirable, each solder ball and corresponding attachment point are proximally situated such that each solder ball is capable of forming an electrical communication with the corresponding attachment point; and 3) reflowing the first object and the second object while the first object and the second object are interacted, such that the first object and the second object are in electrical communication and are physically connected. |
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