Method and device for bonding two plate-shaped objects

A method and a device for bonding a first plate-shaped object to a second plate-shaped object with an adhesive. The adhesive is applied to one of the two surfaces of the first object, whereafter said surface of the first object and one of the two surfaces of the second object are pressed together. T...

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Bibliographische Detailangaben
Hauptverfasser:	KUIKEN, ARJEN W, TEUNISSEN, ERIK J. H. M
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY DYES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method and a device for bonding a first plate-shaped object to a second plate-shaped object with an adhesive. The adhesive is applied to one of the two surfaces of the first object, whereafter said surface of the first object and one of the two surfaces of the second object are pressed together. The plate-shaped objects are rotated at equal rotational velocities about an axis of rotation extending perpendicularly to said surfaces of the objects for at least a time period during which the two objects are being pressed together. In this way, the adhesive present between the two objects spreads homogeneously between the two objects under the influence of the centrifugal force acting on the adhesive, so that a homogeneous, relatively thin and strong layer of adhesive is formed between the two objects. In addition, the pressure with which the objects are to be pressed together is reduced. In a special embodiment, during a first phase, the two objects are moved towards each other at a predetermined relatively low approach speed, and are rotated at a predetermined relatively low rotational speed, and, during a second phase following said first phase, the objects are pressed together with a predetermined compressive force and rotated at a further predetermined relatively high rotational speed. The method and device can be used in the manufacture of SOA-semiconductor devices for bonding a disc-shaped semiconductor substrate to a disc-shaped insulating carrier, such as a glass carrier.