Surface treatment of antireflective layer in chemical vapor deposition process

In a chemical vapor deposition process a surface layer is formed on an antireflective layer to prevent amines in the antireflective layer from neutralizing acid components formed during the exposure of an overlying photoresist layer. The surface layer is formed by introducing an oxygen-containing ga...

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Bibliographische Detailangaben
Hauptverfasser:	VAN DEN HOEK, WILBERT G. M, KONJUH, KATHERINA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	In a chemical vapor deposition process a surface layer is formed on an antireflective layer to prevent amines in the antireflective layer from neutralizing acid components formed during the exposure of an overlying photoresist layer. The surface layer is formed by introducing an oxygen-containing gas such as N2O into the CVD chamber in the presence of radio frequency power, after the antireflective layer has been formed.