Film composition and method for a planar surface atop a plated through hole

The present invention relates to a method for planarizing circuit board apertures wherein a photoimageable film composition comprising a photoimageable dielectric composition and a support film is employed to fill the circuit board apertures. Precircuitized and postcircuitized embodiments are discus...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FLETCHER, MARY BETH, PAPATHOMAS, KONSTANTINOS I, NEDBALSKI, ROBERT L, RAI, AMARJIT SINGH
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	The present invention relates to a method for planarizing circuit board apertures wherein a photoimageable film composition comprising a photoimageable dielectric composition and a support film is employed to fill the circuit board apertures. Precircuitized and postcircuitized embodiments are discussed.