Stenciling method and apparatus for PC board repair

An apparatus and method for aligning fine pitch electrical components and for solder paste stenciling includes a template for aligning an electrical component and for aligning a solder stencil. The template has a window with shelves on opposite sides. Tape is adhered to the shelves across the window...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BENSUSSAN, BERNARD L, GORDON, THOMAS A, URBAN, PAUL LOUIS
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus and method for aligning fine pitch electrical components and for solder paste stenciling includes a template for aligning an electrical component and for aligning a solder stencil. The template has a window with shelves on opposite sides. Tape is adhered to the shelves across the window and is used to secure the template to the desired location on the printed circuit board. The template also includes upright tabs that engage notches in the edges of the stencil for aligning the stencil. A two headed vacuum lifting device is used to lift an aligned component and an aligned stencil from the template. With the template removed from the printed circuit board, the stencil is replaced in the aligned position for solder application. The stencil is removed and the electrical component is placed for soldering.