Polymeric compositions and composites prepared from spiroorthocarbonates and epoxy monomers

Copolymer compositions are provided, including those which undergo less than +/-1.0% bulk polymerization shrinkage and are useful as strain-free composites, high-strength adhesives, and precision castings. The copolymer compositions are formed from the cationic initiated polymerization of alicyclic...

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Bibliographische Detailangaben
Hauptverfasser: BYERLEY, THOMAS J, EICK, J. DAVID, CHAPPELOW, CECIL C
Format: Patent
Sprache:eng
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Zusammenfassung:Copolymer compositions are provided, including those which undergo less than +/-1.0% bulk polymerization shrinkage and are useful as strain-free composites, high-strength adhesives, and precision castings. The copolymer compositions are formed from the cationic initiated polymerization of alicyclic spiroorthocarbonate monomers and epoxy resin monomers or comonomers. A preferred spiroorthocarbonate monomer is 2,3,8,9-di(tetramethylene)-1,5,7,11-tetraoxaspiro-[5,5]undecane. A preferred epoxy resin is a three component epoxy comonomer mixture of (i) diglycidyl ether of bisphenol A, (ii) 3,4-epoxycyclohexanemethyl-3,4-epoxycyclohexane carboxylate, and (iii) vinyl cyclohexene dioxide, preferably in a ratio of 5:4:1 by weight.