Chip carrier processing and shipping array and method of manufacture thereof

A chip carrier which is employed in the industry for mounting integrated circuits and various types of electronic components on chips and is adapted to be positioned within a processing tray or carrier frame for shipping and processing purposes, and wherein the chip carrier is adapted to be precisel...

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Bibliographische Detailangaben
Hauptverfasser:	TRAN, SON KIM, STANKE, DUANE A, KOZOL, JOHN E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A chip carrier which is employed in the industry for mounting integrated circuits and various types of electronic components on chips and is adapted to be positioned within a processing tray or carrier frame for shipping and processing purposes, and wherein the chip carrier is adapted to be precisely positioned and adhesively maintained in a fixed relationships in the carrier frame. Also disclosed is a method of manufacturing chip carrier arrays or strips which are adapted to be positioned in predetermined adhesively fixed relationships within a carrier frame or tray for processing and shipping purposes.