Semiconductor component and method of manufacture

A semiconductor component includes a substrate (101), an electrode (105) located over the substrate (101), a heavily doped region (542) located in the substrate (101) and self-aligned to the electrode (105), an other heavily doped region (543) located in the substrate (101), a lightly doped region (...

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Bibliographische Detailangaben
Hauptverfasser: MA, GORDON C, DRAGON, CHRISTOPHER P
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor component includes a substrate (101), an electrode (105) located over the substrate (101), a heavily doped region (542) located in the substrate (101) and self-aligned to the electrode (105), an other heavily doped region (543) located in the substrate (101), a lightly doped region (422) located in the substrate (101) between the heavily doped regions (542, 543) and self-aligned to the electrode (105), and another lightly doped region (432) located in the substrate (101) between the lightly doped region (422) and the other heavily doped region (543).