Carrier and CMP apparatus

A carrier and CMP apparatus which improve the uniformity of polishing in a wafer or other workpiece and increase the margin of the amount of wear of the retainer ring to improve the operating rate of the CMP apparatus. A carrier 1 is constituted by a housing 10, a carrier base 11, a retainer ring 12...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA, HIDEO, IZUMI, SHIGETO, SUGIYAMA, MISUO, SHIMIZU, TOSHIKUNI, ARAI, HATSUYUKI, WANG, XU-JIN, MATSUBARA, HISATO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A carrier and CMP apparatus which improve the uniformity of polishing in a wafer or other workpiece and increase the margin of the amount of wear of the retainer ring to improve the operating rate of the CMP apparatus. A carrier 1 is constituted by a housing 10, a carrier base 11, a retainer ring 12, a sheet supporter 13, a hard sheet 18, and a soft backing sheet 19. The sheet supporter 13 is formed by a supporter body portion 14 having an air opening 14a communicating with an air outlet/inlet 11b of the carrier base 11, a flexible diaphragm 15, and an edge ring 16. Therefore, a wafer W is uniformly pressed by the air pressure in the pressure chamber R and fluctuation in the force pressing against the outer peripheral rim of the wafer W caused by the wear of the retainer ring 12 is countered by the diaphragm 15.