Method of bonding a diamond substrate to at least one metal substrate

The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of aluminum foil are disposed in a chamber un...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: RANCHY, ERIC, PETITBON, ALAIN
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator RANCHY
ERIC
PETITBON
ALAIN
description The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of aluminum foil are disposed in a chamber under a controlled atmosphere, and they are bonded together by a first thermocompression step under Argon or under a vacuum, thereby forming a composite multilayer substrate; said composite multilayer substrate is disposed on a metal substrate, the aluminum surface being in contact with the metal substrate; and said composite multilayer substrate and said metal substrate are bonded together by performing a second thermocompression step.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US6006979A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US6006979A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US6006979A3</originalsourceid><addsrcrecordid>eNrjZHD1TS3JyE9RyE9TSMrPS8nMS1dIVEjJTMwFchSKS5OKS4oSS1IVSvIVEksUclITi0sU8vNSFXJTSxJzEPI8DKxpiTnFqbxQmptB3s01xNlDN7UgPz61uCAxOTUvtSQ-NNjMwMDM0tzS0ZiwCgDzxDI0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of bonding a diamond substrate to at least one metal substrate</title><source>esp@cenet</source><creator>RANCHY; ERIC ; PETITBON; ALAIN</creator><creatorcontrib>RANCHY; ERIC ; PETITBON; ALAIN</creatorcontrib><description>The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of aluminum foil are disposed in a chamber under a controlled atmosphere, and they are bonded together by a first thermocompression step under Argon or under a vacuum, thereby forming a composite multilayer substrate; said composite multilayer substrate is disposed on a metal substrate, the aluminum surface being in contact with the metal substrate; and said composite multilayer substrate and said metal substrate are bonded together by performing a second thermocompression step.</description><edition>6</edition><language>eng</language><subject>ARTIFICIAL STONE ; BASIC ELECTRIC ELEMENTS ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMBINED OPERATIONS ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LIME, MAGNESIA ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; OTHER WORKING OF METAL ; PERFORMING OPERATIONS ; REFRACTORIES ; SEMICONDUCTOR DEVICES ; SLAG ; TRANSPORTING ; TREATMENT OF NATURAL STONE ; UNIVERSAL MACHINE TOOLS</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19991228&amp;DB=EPODOC&amp;CC=US&amp;NR=6006979A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19991228&amp;DB=EPODOC&amp;CC=US&amp;NR=6006979A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RANCHY; ERIC</creatorcontrib><creatorcontrib>PETITBON; ALAIN</creatorcontrib><title>Method of bonding a diamond substrate to at least one metal substrate</title><description>The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of aluminum foil are disposed in a chamber under a controlled atmosphere, and they are bonded together by a first thermocompression step under Argon or under a vacuum, thereby forming a composite multilayer substrate; said composite multilayer substrate is disposed on a metal substrate, the aluminum surface being in contact with the metal substrate; and said composite multilayer substrate and said metal substrate are bonded together by performing a second thermocompression step.</description><subject>ARTIFICIAL STONE</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHEMISTRY</subject><subject>COMBINED OPERATIONS</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LIME, MAGNESIA</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>OTHER WORKING OF METAL</subject><subject>PERFORMING OPERATIONS</subject><subject>REFRACTORIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SLAG</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF NATURAL STONE</subject><subject>UNIVERSAL MACHINE TOOLS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD1TS3JyE9RyE9TSMrPS8nMS1dIVEjJTMwFchSKS5OKS4oSS1IVSvIVEksUclITi0sU8vNSFXJTSxJzEPI8DKxpiTnFqbxQmptB3s01xNlDN7UgPz61uCAxOTUvtSQ-NNjMwMDM0tzS0ZiwCgDzxDI0</recordid><startdate>19991228</startdate><enddate>19991228</enddate><creator>RANCHY; ERIC</creator><creator>PETITBON; ALAIN</creator><scope>EVB</scope></search><sort><creationdate>19991228</creationdate><title>Method of bonding a diamond substrate to at least one metal substrate</title><author>RANCHY; ERIC ; PETITBON; ALAIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6006979A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>ARTIFICIAL STONE</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHEMISTRY</topic><topic>COMBINED OPERATIONS</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LIME, MAGNESIA</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>OTHER WORKING OF METAL</topic><topic>PERFORMING OPERATIONS</topic><topic>REFRACTORIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SLAG</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF NATURAL STONE</topic><topic>UNIVERSAL MACHINE TOOLS</topic><toplevel>online_resources</toplevel><creatorcontrib>RANCHY; ERIC</creatorcontrib><creatorcontrib>PETITBON; ALAIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RANCHY; ERIC</au><au>PETITBON; ALAIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of bonding a diamond substrate to at least one metal substrate</title><date>1999-12-28</date><risdate>1999</risdate><abstract>The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of aluminum foil are disposed in a chamber under a controlled atmosphere, and they are bonded together by a first thermocompression step under Argon or under a vacuum, thereby forming a composite multilayer substrate; said composite multilayer substrate is disposed on a metal substrate, the aluminum surface being in contact with the metal substrate; and said composite multilayer substrate and said metal substrate are bonded together by performing a second thermocompression step.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US6006979A
source esp@cenet
subjects ARTIFICIAL STONE
BASIC ELECTRIC ELEMENTS
CEMENTS
CERAMICS
CHEMISTRY
COMBINED OPERATIONS
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LIME, MAGNESIA
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
OTHER WORKING OF METAL
PERFORMING OPERATIONS
REFRACTORIES
SEMICONDUCTOR DEVICES
SLAG
TRANSPORTING
TREATMENT OF NATURAL STONE
UNIVERSAL MACHINE TOOLS
title Method of bonding a diamond substrate to at least one metal substrate
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T21%3A17%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=RANCHY;%20ERIC&rft.date=1999-12-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS6006979A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true