Method of bonding a diamond substrate to at least one metal substrate

The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of aluminum foil are disposed in a chamber un...

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Bibliographische Detailangaben
Hauptverfasser:	RANCHY, ERIC, PETITBON, ALAIN
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMBINED OPERATIONS COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY OTHER WORKING OF METAL PERFORMING OPERATIONS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TRANSPORTING TREATMENT OF NATURAL STONE UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:	The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of aluminum foil are disposed in a chamber under a controlled atmosphere, and they are bonded together by a first thermocompression step under Argon or under a vacuum, thereby forming a composite multilayer substrate; said composite multilayer substrate is disposed on a metal substrate, the aluminum surface being in contact with the metal substrate; and said composite multilayer substrate and said metal substrate are bonded together by performing a second thermocompression step.