Heat protective enclosure and heat protected electronic device

In a high-temperature protective arrangement for an electronic device, which as such generates heat, the electronic device is enclosed by a heat protective enclosure provided with gaps for permitting heat removal by air convection. The heat protective enclosure is coated with a material which is sub...

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Bibliographische Detailangaben
Hauptverfasser:	KUMMLE, WOLFGANG, MESSMER, HELMUT
Format:	Patent
Sprache:	eng
Schlagworte:	AIRCRAFT ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSIONTRANSMISSIONS IN AIRCRAFT AVIATION CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COSMONAUTICS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EQUIPMENT FOR FITTING IN OR TO AIRCRAFT FLYING SUITS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PARACHUTES PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING VEHICLES OR EQUIPMENT THEREFOR
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Beschreibung
Zusammenfassung:	In a high-temperature protective arrangement for an electronic device, which as such generates heat, the electronic device is enclosed by a heat protective enclosure provided with gaps for permitting heat removal by air convection. The heat protective enclosure is coated with a material which is subject to swelling under the action of heat to a multiple of the thickness of the original coating whereby a heat-insulating layer is formed and the gaps are closed. Electronic components of the electronic device are disposed within a housing. The heat generated by the electronic components is passed to the housing which is surrounded at a spacing substantially on all sides by the heat protective enclosure.