Angled interconnect panel assembly for telecommunications applications

An angled interconnect panel assembly includes an enclosure, a plurality of support brackets mounted inside the enclosure, a plurality of interconnect panels which are each pivotally mounted to one of the support brackets and are each disposed in an angled position when at rest between adjacent support brackets, and a pair of key-operated lock mechanisms for locking or holding the interconnect panels in their angled positions. The enclosure has a pair of opposite end walls and defines wire entry ports in the end walls. One wire entry port is for passage of user wiring into the assembly while the other of the wire entry ports is for passage of technician wiring into the assembly. Each interconnect panel has opposite user and technician sides and defines a plurality of openings extending between the opposite user and technician sides for receiving one or more interconnection members. The assembly also includes a pair of front closure doors. The pair of key-operated lock mechanisms, in combination with the front closure doors, makes it necessary to use a key to obtain access to a technician portion of the assembly while access to a user portion of the assembly is open and available. The angled position of each of the interconnect panels permits maximum wire density and use of the assembly.