Method of manufacturing an integrated circuit using chemical mechanical polishing

Method of manufacturing an integrated circuit using chemical mechanical polishing

A method of manufacturing integrated circuits using a carrier fixture. The carrier fixture does not include transport channels or openings for directing a slurry to a substrate being polished and, as a result, damage to the substrate is reduced because the edges adjacent to the substrate are elimina...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CREVASSE, ANNETTE MARGARET, EASTER, WILLIAM GRAHAM, MAZE, III, JOHN ALBERT, SOWELL, JOHN THOMAS
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:A method of manufacturing integrated circuits using a carrier fixture. The carrier fixture does not include transport channels or openings for directing a slurry to a substrate being polished and, as a result, damage to the substrate is reduced because the edges adjacent to the substrate are eliminated. The present invention further provides a carrier fixture having an inner support coupled to a ring member that contacts a substrate during the CMP process. The present invention also provides a carrier fixture having inner and outer supports coupled to a ring member.