Apparatus and method for cleaning a liquid dispensing nozzle

The present invention provides an apparatus and a method for cleaning a liquid dispensing nozzle that is utilized in semiconductor process machines by providing a cleaning solvent reservoir tank capable of receiving a dispensing nozzle and then flowing a cleaning solvent through the nozzle under pressure, and then purging through the dispensing nozzle with a processing fluid to later be utilized such that any residual cleaning solvent is purged out of the dispensing nozzle to prevent the possible back-flow or syphoning of the cleaning solvent into a processing fluid supply and the dilution of such processing fluid. The present invention apparatus is further equipped with a cleaning solvent buffer tank for holding and feeding a cleaning solvent to the reservoir tank such that the pressure in the reservoir tank can be suitably controlled.