Multilayer ceramic circuit boards including embedded capacitors

Embedded capacitors are formed in multilayer ceramic circuit boards by screen printing a capacitor ink sandwiched between conductor ink layers onto a green tape stack and covering the ink layer with one or two green tapes, and aligning the green tape layers, and firing. The green tapes are made of a...

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Bibliographische Detailangaben
Hauptverfasser:	PRABHU, ASHOK NARAYAN, TORMEY, ELLEN SCHWARTZ, SREERAM, ATTIGANAL NARAYANASWAMY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	Embedded capacitors are formed in multilayer ceramic circuit boards by screen printing a capacitor ink sandwiched between conductor ink layers onto a green tape stack and covering the ink layer with one or two green tapes, and aligning the green tape layers, and firing. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which do not shrink in the x and y dimensions during firing. Thus the capacitors can be made to close tolerances.