Chemical curing of epoxidized diene polymers using aromatic anhydride curing agents

A process for curing epoxidized diene polymers for use in adhesives, sealants, and coatings which comprises contacting the polymer with an aromatic anhydride curing agent at an epoxy/anhydride molar ratio from 0.5/1 to 2.0/1.0, optionally, and from 0.1 to 10 phr of an accelerator at a temperature of...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MASSE, MICHAEL ALAN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A process for curing epoxidized diene polymers for use in adhesives, sealants, and coatings which comprises contacting the polymer with an aromatic anhydride curing agent at an epoxy/anhydride molar ratio from 0.5/1 to 2.0/1.0, optionally, and from 0.1 to 10 phr of an accelerator at a temperature of from 100 to for a period of 10 minutes to six hours.