Work supplying method and apparatus to batch process apparatus for semiconductor wafer with preferential treatment to time critical lots

The invention provides a work supply method and apparatus for a batch process apparatus for semiconductor wafers by which works having a comparatively severe delivery date are processed preferentially. A processing end time calculation section of a batch formation control section refers to a history...

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creator TOGASHI
YOICHI
description The invention provides a work supply method and apparatus for a batch process apparatus for semiconductor wafers by which works having a comparatively severe delivery date are processed preferentially. A processing end time calculation section of a batch formation control section refers to a history file in response to a processing start report from a batch process apparatus to predict a processing end time. A work extraction section refers to a step management file to extract those of the works which can arrive at a batch process apparatus on or prior to the thus predicted processing end time. A batch formation section forms, designating the extracted works as an object of batch formation, the works into a batch such that one of the works which has the highest preferential degree is designated as a top work of the batch. A transport section transports the works of the batch collectively to the batch process apparatus.
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subjects BASIC ELECTRIC ELEMENTS
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PHYSICS
REGULATING
SEMICONDUCTOR DEVICES
title Work supplying method and apparatus to batch process apparatus for semiconductor wafer with preferential treatment to time critical lots
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