Work supplying method and apparatus to batch process apparatus for semiconductor wafer with preferential treatment to time critical lots

The invention provides a work supply method and apparatus for a batch process apparatus for semiconductor wafers by which works having a comparatively severe delivery date are processed preferentially. A processing end time calculation section of a batch formation control section refers to a history file in response to a processing start report from a batch process apparatus to predict a processing end time. A work extraction section refers to a step management file to extract those of the works which can arrive at a batch process apparatus on or prior to the thus predicted processing end time. A batch formation section forms, designating the extracted works as an object of batch formation, the works into a batch such that one of the works which has the highest preferential degree is designated as a top work of the batch. A transport section transports the works of the batch collectively to the batch process apparatus.