Thermally enhanced lead-under-paddle I.C. leadframe

A "lead-under-paddle" (LUP) leadframe employs a thermally conductive paddle/heat sink, the top side of which is adhered to an I.C. die with a thermally conductive adhesive. The inner portions of an I.C. package's leads extend along and are attached to the bottom side of the paddle with a thermally conductive and electrically isolating adhesive. Heat generated by the die is conducted to the leads and out of the package via the paddle/heat sink. The leads are in close contact with the paddle and die, reducing the leadframe's thermal resistance, increasing the amount of power that can be consumed by the die, and enabling a standard I.C. package to accommodate a paddle and die having larger respective surface areas.