Processing system hot plate construction substrate

Processing system hot plate construction substrate

In a substrate thermal processing device, a temperature of a substrate can be precisely controlled within a short time by means of a hot plate oven. The substrate thermal processing device includes a substrate supporting plate for supporting the substrate, an auxiliary heating/cooling section for he...

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Hauptverfasser: HISAI, AKIHIRO, MATSUNAGA, MINOBU, KOBAYASHI, HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HISAI
AKIHIRO
MATSUNAGA
MINOBU
KOBAYASHI
HIROSHI
description In a substrate thermal processing device, a temperature of a substrate can be precisely controlled within a short time by means of a hot plate oven. The substrate thermal processing device includes a substrate supporting plate for supporting the substrate, an auxiliary heating/cooling section for heating or cooling the substrate and having a Peltier effect element and disposed on a lower surface of the substrate supporting plate, and a main heating section for heating the substrate and disposed below the substrate supporting plate and the auxiliary heating/cooling section.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Processing system hot plate construction substrate
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